A Yuan, S Fang, Z Wang, H Liu - Electronics, 2021 - mdpi.com
A novel multifunctional negative group delay circuit is proposed. The circuit can realize three different negative group delay functions, including band-pass, high-pass and low-pass …
N Wary, P Mandal - IEEE Journal of Solid-State Circuits, 2017 - ieeexplore.ieee.org
This paper presents an energy efficient full-duplex (FD) current-mode transceiver for on-chip global interconnects. As it shares the same signaling port for transmitting and receiving …
B Ravelo - IEEE Transactions on Circuits and Systems II …, 2016 - ieeexplore.ieee.org
This brief describes a synthesis of high-pass negative group delay (NGD) network impedance. The fundamental expression of the high-pass NGD canonical transfer function is …
F Celik, A Akkaya, Y Leblebici - Microelectronics Journal, 2021 - Elsevier
This paper presents a 32 Gb/s 16-level pulse amplitude modulation (PAM-16) source-series- terminated transmitter (TX) and a receiver (RX) analog front-end (AFE) in 28 nm FDSOI. The …
Negative Group Delay (NGD) is a concept not widely explored in embedded digital signal processing systems, and this study aims to fill this gap. It presents a novel methodology for …
DH Kwon, M Kim, SG Kim… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
We demonstrate a 40-Gb/s PAM-4 transmitter having 2-tap pre-emphasis, whose power consumption is significantly reduced by the use of toggling serializers. In addition, a new …
M Jalalifar, GS Byun - Analog Integrated Circuits and Signal Processing, 2020 - Springer
A simultaneous and reconfigurable multi-level RF-interconnect (MRI) for global network-on- chip (NoC) communication is demonstrated. The proposed MRI interface consists of …
We present a methodology for implementing NGD using a Finite Impulse Response (FIR) filter. The NGD concept is counter-intuitive in nature, so we first provide the basic theory of …
The authors propose a hybrid transceiver and an energy‐efficient link architecture for bidirectional multipoint‐to‐multipoint signalling across on‐chip global interconnect. The …