Noise probably the single most important performance metric of the high-speed
transimpedance amplifier (TIA), which directly sets the sensitivity of optical receiver. The …

By using the flip-chip bonding technology, a high performances 3D-integrated silicon
photonics receiver is demonstrated. The receiver consists of a high-speed germanium …

This article first analytically compares the energy efficiency of a serial optical link with a
parallel link with the same data throughput and bit error rate for interchip communication …

The existing control methods have the problem of imperfect automatic distribution linkage
model, which leads to excessive noise in the process of practical application. This paper …

An energy-efficient dual-channel receiver (RX) for short-range optical interconnects is
integrated in a 45-nm RF/photonic process and characterized for electrical bandwidth to de …

A 4× 112 Gb/s hybrid-integrated optical receiver is demonstrated based on the silicon-
photonic vertical pin photodetector and silicon–germanium transimpedance amplifier. We …

This paper presents a 50-Gb/s optical receiver chipset in 45-nm silicon-on-insulator (SOI)
CMOS. It comprises a trans-impedance amplifier (TIA) cascaded by a clock and data …

A 100 Gbit/s NRZ and 128 Gbit/s PAM-4 3D-integrated silicon photonics receiver with low
power consumption is reported. The receiver is implemented based on flip-chip 3D …

The trend of continually increasing demand for high-performance computation in artificial
intelligence, cloud computing, and virtual/augmented reality requires increasing chip-to-chip …