Aqueous zinc‐ion batteries (ZIBs) are promising candidates for the next‐generation high‐
energy storage devices, owing to their resource availability, low cost, eco‐friendliness, and …

High density interconnection printed circuit board PCB puts forward high requirements for
defect free blind holes copper filling. Here, 5-amino-1, 3, 4-thiadiazole-2-mercaptan, a small …

Leveler is one of the most important additives for super-conformal copper electroplating,
which has been widely applied in the fabrication of nanoscale (or microscale) interconnect …

A novel chlorinated functional group-modified triphenylmethane derivative leveler BB1 is
used to achieve superconformal electrodeposition in microvias. Cyclic voltammetry (CV) and …

A three–additive combination of an accelerator, a polymeric suppressor, and an organic
leveler is typically utilized in the electrodeposition process to achieve Cu bottom–up filling of …

Optimizing a high-quality leveler has become the core task in developing the microvia
copper filling technology. In this work, two nitrogen-containing heterocyclic compounds …

Accelerators are indispensable additives for super-conformal copper electrodeposition,
which has been widely applied in the fabrication of integrated circuits (ICs), printed circuit …

Microstructural replication accuracy in precision micro electroforming process is related to
ions transportation inside the micro structure and microstructural feature width and aspect …

Levelers, as an essential part of organic additives in copper electroplating, play a crucial
role in the fabrication of sophisticated interconnects in integrated circuits, packaging …

Shortening the Cu gap-filling time at microvias by electrodeposition is critical for increasing
the productivity of printed circuit board (PCB) fabrication. Additives that can facilitate …