Thermoelectric modules can convert waste heat directly into useful electricity, providing a
clean and sustainable way to use fossil energy more efficiently. Mg3Sb2-based alloys have …

In this article, an SiC die was directly attached on a bare DBA (Al/AlN/Al) substrate via
micron-sized Ag sintering at 250° C without pressure. The micron-sized structure of the Ag …

As an important interconnection material in electronics, conductive silver paste has attracted
much research interest in chip packaging and printed circuit board due to its predominant …

Large-scale industrialization of flexible printed electronics will thrive on advanced functional
conductive pastes with excellent properties such as high electrical conductivity and …

The effect of the addition volume of Ni on the microstructures and tensile and fatigue
properties of Sn-6.4 Sb-3.9 Ag (mass%) was investigated using micro-size specimens. The …

Abstract An Ag–Au joint developed by Ag paste joining on electroless nickel/electroless
palladium/immersion gold (ENEPIG)-plated direct-bonded aluminum (DBA) substrate was …

For 3D-printing circuits, highly electrical conductive composite filaments were prepared
through thin-film transition technique and hot extrusion-drawing. In the filaments, flaky silver …

In this study, the thermal characteristics and structure reliability during power cycling for the
four types of SiC power module fabricated using a SiC-heater chip, direct bonded aluminum …

In flexible electronics, a highly electroconductive, flexible, and durable material is important
for various applications. This study describes the property changes in graphene nanosheets …

Nanopaste is essential in the packaging of high-power devices, but the sintering kinetics of
nanoparticles is still unclear. In this paper, the sintering process of Ag nanoparticles with …