Flexible and stretchable electronics can dramatically enhance the application of electronics
for the emerging Internet of Everything applications where people, processes, data and …

Solid-state memory is an essential component of the digital age. With advancements in
healthcare technology and the Internet of Things (IoT), the demand for ultra-dense, ultra-low …

Controlled spalling is a fast process that can mechanically exfoliate III-V semiconductor
layers from their host wafer substrates and has the potential to produce high power-density …

In this paper, we report on the first solar cells fabricated on silicon foils employing the stress-
induced liftoff methodcut technique and using an epoxy stress-inducing layer. The latter is a …

Using kerf-free wafering technologies material losses in semiconductor manufacturing
processes can be reduced drastically. By the use of externally applied stress, crystalline …

The major barrier for PV penetration is cost. And the single most important cost factor in
silicon technology is the wafer (≈ 35% of the module cost). Although tremendous progress …

In this work, we report recent results of solar cells fabricated on silicon foils obtained by the
Stress induced LIft-off Method (SLIM)-cut technique using an epoxy stress-inducing layer …

Despite having world record efficiencies, high costs associated with deposition and the
substrate have barred III-V entry into terrestrial PV markets. Substrate reuse technology …

Substrate reuse technologies focus on reducing photovoltaic device costs via substrate
utilization over multiple devices. The three common substrate reuse strategies include …

In this work, results of controlled detachment of (111) silicon by stress induced spalling (SIS)
process, which is based on a gluing on a metallic stressor layer by an epoxy adhesive on …