Detailed thermal dynamics of high-power IGBT modules are important information for the
reliability analysis and thermal design of power electronic systems. However, the existing …

High-temperature and temperature nonuniformity in high-performance integrated circuits
(ICs) can significantly degrade chip performance and reliability. Thus, accurate temperature …

Virtual prototyping of power electronic modules aims to allow rapid evaluation of potential
designs without the need to resort to building and testing physical prototypes. A key …

Fractional order systems in continuous time case are shown to be infinite-dimensional,
which is an essential feature used for analysis and synthesis. The objective of this paper is …

Under a given set of boundary conditions (BCs), the thermal performance of an electronic
system is generally evaluated based on its steady-state response to constant power loads …

The objective of this paper is to analyze the dynamics of heat flow in thermal structures
working under constant temperature operation. This analysis is made using the tools of …

The Cauer thermal network has made a realistic physical representation of thermal
behaviour of a multi‐chip module (MCM) theoretically possible. However, the traditional …

Chips specifically designed for thermal tests such as the assessment of packages, are of
main interest in Microelectronics. Nevertheless, these test dies are required in relatively low …

The main drawback of line-interactive and passive standby uninterruptible power supplies
(UPS) is the transfer time when changing from normal mode of operation to battery mode of …

The objective of this paper is to obtain time-varying models of the thermal dynamics of a 3D
hot thin film anemometer for Mars atmosphere. To this effect, a proof of concept prototype of …