We report on the results of an experimental comparison of different types of squeegee blade
used in the stencil printing of solder pastes for reflow soldering in SMT, concentrating on …

The formation of reliable solder joints in electronic assemblies is a critical issue in surface
mount manufacturing. Stringent control is placed on the solder paste deposition process to …

The widespread deployment of fuel cell technology requires the development of new
manufacturing technologies to turn it economically viable. Stencil printing is known as one of …

Solder paste is used for reflow soldering of Surface Mount Devices (SMDs). In this paper we
discuss how the various stages of the stencil printing cycle affect the rheological properties …

The objectives of this research are to model the screening process with planned
experiments and to identify the optimal setting of the process parameters so as to minimize …

Many simulators employ computer-generated images as part of the training process, and the
concept of a virtual environment is nothing new to the industry. However, immersive and …

The solder paste printing process is an important process in the assembly of Surface Mount
Technology (SMT) devices using the reflow soldering technique. There is a wide agreement …

Advanced electronics packaging technologies such as chip scale packages, fine pitch ball
grid arrays, and flip chip are pushing solder paste stencil printing to the limit. In order to …

This paper presents a technique for mapping the modelling of manufacturing processes, in
which process maps are used to represent information on the models and modelling …

The need for higher pin count, higher performance, smaller size and lighter weight has
driven the development of advanced packages such as Quad Flat Package (QFP), Ball Grid …