This paper provides a comprehensive overview of typical substrate crack failure modes
under harsh temperature cycling test (TCT). Design features associated with substrate crack …

Delamination failure is one of the most prevalent and serious reliability issues in micro-
electronic packaging. To understand this phenomenon further, this study constructs an …

Microelectronics packages play a vital role in not only interconnecting the electronic signals
from the die to the printed circuit board (PCB), but also in protecting the chips during the …

New thermal interface materials (TIM) with liquid metal (LM) as the main component show
many advantages in the field of thermal management. However, it is prone to leakage and …

Fan-out (FO) packages are in high demand for smartphones and Internet of Things (IoT)
devices because they allow for the integration of multiple components within a single …

Recently, the demand of IC Packages has grown rapidly in automotive applications.
Advanced Driver Assistance Systems (ADAS) require more powerful and more chips to …

Electronic products have been evolving towards high performance and high integration to
meet the demands of high-performance computing, next-generation mobile communication …

The microelectronics package is not only interconnecting the electronic signals from die to
the printed circuit board (PCB), but also avoid the chips fracture during the manufacturing …