Void nucleation is a critical issue in wetting because it negatively impacts the solder joint
and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect …

We examine the effect of grain size on the dynamic failure of tantalum during laser-shock
compression and release and identify a significant effect of grain size on spall strength …

Structural materials are subjected to combinations of stress and corrosive environments that
work synergistically to cause premature failure. Therefore, studies on the combined effect of …

This research investigated the effects of rapid thermal shock cycle on the internal cracks,
microstructure and internal cracks of SAC305 ball by applying non-destructive high energy …

The microstructure evolution of surface-encapsulated Sn-0.7 Cu solder volumes of
approximately 230 μm diameter is observed from electromigration tests at 150° C and with …

In microelectronics applications, SnAgCu lead-free solder joints play the important role of
ensuring both the mechanical and electrical integrity of the components. In such …

Quantitative analysis of mineral compositions is essential in understanding geochemical,
mineralogical and environmental processes. Fine-resolution 3D imaging is widely done …

Nondestructive testing of packaged chips is essential for ensuring product performance, yet
existing methods have serious drawbacks. Here, we apply photoacoustic remote sensing …

This work provides an analysis of X-ray micro computed tomography data of Sn-xBi solders
with x= 20, 30, 35, 47, 58 wt.% Bi. The eutectic thickness, fraction of eutectic and primary …

In x-ray imaging, the interaction of stray x-rays with an imaging sensor may produce speckle-
type noise (ie zingers) which produces artifacts in tomography reconstructions. Zinger …