As the minimum feature size of integrated circuit elements has shrunk below 7 nm, chemical
mechanical planarization (CMP) technology has grown by leaps and bounds over the past …

Chemical mechanical polishing (CMP) is an essential semiconductor manufacturing process
because of its local and global planarization ability in fabricating highly integrated devices …

The material removal rate (MRR) plays a critical role in the chemical mechanical
planarization (CMP) process in the semiconductor industry. Many physics-based and data …

The micro-scale contact status between pad and workpiece surface plays one of the most
significant roles in determining the material removal rate (MRR) during the chemical …

A series of Ce 1-x M x O 2 abrasives with different types and amounts of doping were
prepared by molten salt method. The properties of abrasives were characterized in detail by …

Manufacturing paradigms have historically been shaped by social, economic, and
technological aspect, including limitations and needs. Design for manufacturing (DFM) has …

We report the design and synthesis of meso-silica/ceria binary composite particles and their
usage as functionalized abrasives for photochemical mechanical polishing (PCMP). Meso …

Micromanufacturing processes are expanding in their length and breadth as long as the
related research and development (R&D) activities and applications are concerned …

Chemical mechanical planarization (CMP) has been widely used in the semiconductor
industry to create planar surfaces with a combination of chemical and mechanical forces. A …

Fine finishing of tungsten alloy is required to improve the surface quality of molds and
precision instruments. Nevertheless, it is difficult to obtain high-quality surfaces as a result of …