Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading
Ball grid array (BGA) is one of the most innovative semiconductor packaging technologies
which is capable of high input-output capacities while addressing handling and coplanarity …
which is capable of high input-output capacities while addressing handling and coplanarity …
[PDF][PDF] Modeling and simulation of fatigue damage in power semiconductors
M Springer - 2017 - researchgate.net
One of the main design challenges for modern power semiconductor devices is the
reduction of the device footprint while maintaining or even increasing the power density …
reduction of the device footprint while maintaining or even increasing the power density …
FEA of thermal warpage in ball grid array with consideration of molding compound residual strain compared to experimental measurements
As semiconductor devices continue to advance in terms of having smaller and denser
designs, the semiconductor packages, in turn, must keep up with the changes to prevent the …
designs, the semiconductor packages, in turn, must keep up with the changes to prevent the …
[PDF][PDF] Numerical simulations of fatigue crack problems in semiconductor devices subjected to thermomechanical loading
G Kravchenko - 2014 - scholar.archive.org
Modern power semiconductor devices used in automotive products and industrial systems
have to reliably withstand up to 109 and more high power density electrical pulses. The heat …
have to reliably withstand up to 109 and more high power density electrical pulses. The heat …
FEM study of fatigue crack growth in a power semiconductor chip subjected to transient thermal loading
G Kravchenko, B Karunamurthy… - Procedia materials …, 2014 - Elsevier
A detailed finite element analysis of fatigue crack growth between metallisation layers of a
power semiconductor device subjected to active cycling conditions is carried out. The active …
power semiconductor device subjected to active cycling conditions is carried out. The active …
Finite-element analysis of coupled electro-thermal problems with strong scale separation
S Eiser, M Bernardoni, M Nelhiebel… - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
We present a finite-element analysis of the coupled electro-thermal behavior of a mm 2-
sized power DMOS device, with a focus on resolving μm-sized structures. For a reliable …
sized power DMOS device, with a focus on resolving μm-sized structures. For a reliable …