During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important
role in the properties of the Sn-based solder joint. In the present study, Ni and Co …

Cu/SAC305/Cu solder joints were fabricated by a modified ultrasonic-assisted reflow
soldering technique under ambient atmosphere. Ultrasonic vibration (USV) with low …

Composite filler metal refers to the traditional filler metal by adding a certain proportion of
various forms of superalloy, carbon fiber and ceramic particles as reinforcement phase. Due …

The effect of nanosized Co admixtures on the microstructure and physical properties of Sn–
3.8 Ag–0.7 Cu solder and corresponding solder joints was investigated. The composite Sn …

The Sn-Ag-Cu (SAC) alloy family is commonly used in lead-free solders employed in the
electronics industry, for instance, SAC305, SAC387, SAC405, etc. However, the trend in …

In this study, cobalt (Co) particles were incorporated as reinforcing agents into the Sn58Bi
solder. The solderability of the solder and the strength of the solder joints were investigated …

The main number of current researches has been focused on the microstructure and
mechanical properties of the Sn-based Sn–Ag–Cu-based solders, while various kinds of …

Miniaturization of electronic devices causes reliability issues in solder joints such as a
reduction in mechanical, structural, and electrical properties. This work focuses on studying …

The electrical conductivity of nanocomposite Sn-3.0 Ag-0.5 Cu alloys with two different
weight percentages of Ni nanoparticles (1.0 and 2.0 wt.%) was measured over a wide …