Nowadays, the cooling of electronic components that are widely spread globally is
considered a critical issue. Designers and engineers alike confront major obstacles in …

As the miniaturization of electronic devices continues and the heat flux increases rapidly,
thermal management techniques are facing serious challenges. Microchannel heat sinks …

Numerical study has been carried out to examine the heat transfer and fluid flow
characteristics of open microchannel heat sinks consist of square pin fins. Variation of fin …

As demand for high-performance heat transfer increases, interest in microchannel heat sinks
as a viable solution for heat flux removal in thermal devices has grown significantly …

An improved design of wavy microchannel heat sink with changing wavelength or/and
amplitude along the flow direction is proposed. The thermal resistance R and the maximum …

In this study, a detailed numerical analysis of the fluid flow and heat transfer of a three-
dimensional microchannel is performed to evaluate the effect of using periodic vertical …

With progress in technology and miniaturization of electronic devices, liquid coolants were
used increasingly in personal computers, laptops, servers, and supercomputers. Micro heat …

A three-dimensional numerical simulation was conducted to study the characteristics of fluid
flow and heat transfer in new design of microchannel heat sink with sinusoidal cavities and …

Active and passive cooling are the two possible methods for removing heat. An active
cooling system is the one that involves the use of energy as opposed to passive cooling that …

In the present study, turbulent flow and heat transfer inside a three-dimensional wavy
microchannel with different wavelengths have been numerically simulated. The main …