Mapping on multi/many-core systems: Survey of current and emerging trends

AK Singh, M Shafique, A Kumar, J Henkel - Proceedings of the 50th …, 2013 - dl.acm.org
The reliance on multi/many-core systems to satisfy the high performance requirement of
complex embedded software applications is increasing. This necessitates the need to …

A survey and comparative study of hard and soft real-time dynamic resource allocation strategies for multi-/many-core systems

AK Singh, P Dziurzanski, HR Mendis… - ACM Computing Surveys …, 2017 - dl.acm.org
Multi-/many-core systems are envisioned to satisfy the ever-increasing performance
requirements of complex applications in various domains such as embedded and high …

Temperature-constrained reliability optimization of industrial cyber-physical systems using machine learning and feedback control

J Zhou, L Li, A Vajdi, X Zhou… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
As the backbone of Industry 4.0, industrial cyber-physical systems (ICPSs) that are
geographically dispersed, federated, cooperative, and security-critical systems become the …

Thermal and energy management of high-performance multicores: Distributed and self-calibrating model-predictive controller

A Bartolini, M Cacciari, A Tilli… - IEEE Transactions on …, 2012 - ieeexplore.ieee.org
As result of technology scaling, single-chip multicore power density increases and its spatial
and temporal workload variation leads to temperature hot-spots, which may cause …

Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads

J Li, M Qiu, JW Niu, LT Yang, Y Zhu… - ACM Transactions on …, 2013 - dl.acm.org
Chip multiprocessor (CMP) techniques have been implemented in embedded systems due
to tremendous computation requirements. Three-dimension (3D) CMP architecture has been …

Mapping techniques in multicore processors: current and future trends

M Gupta, L Bhargava, S Indu - The Journal of Supercomputing, 2021 - Springer
Multicore systems are in demand due to their high performance thus making application
mapping an important research area in this field. Breaking an application into multiple …

Design and architectures for dependable embedded systems

J Henkel, L Bauer, J Becker, O Bringmann… - Proceedings of the …, 2011 - dl.acm.org
The paper presents an overview of a major research project on dependable embedded
systems that has started in Fall 2010 and is running for a projected duration of six years. Aim …

Thermal management for 3d-stacked systems via unified core-memory power regulation

Y Shen, L Schreuders, A Pathania… - ACM Transactions on …, 2023 - dl.acm.org
3D-stacked processor-memory systems stack memory (DRAM banks) directly on top of logic
(CPU cores) using chiplet-on-chiplet packaging technology to provide the next-level …

NeuroMap: Efficient task mapping of deep neural networks for dynamic thermal management in high-bandwidth memory

S Pandey, PR Panda - … on Computer-Aided Design of Integrated …, 2022 - ieeexplore.ieee.org
High-bandwidth memory (HBM) offers breakthrough memory bandwidth through its vertically
stacked memory architecture and through-silicon via (TSV)-based fast interconnect …

Thermal-constrained task allocation for interconnect energy reduction in 3-D homogeneous MPSoCs

Y Cheng, L Zhang, Y Han, X Li - IEEE Transactions on Very …, 2012 - ieeexplore.ieee.org
3-D technology that stacks silicon dies with through silicon vias (TSVs) is a promising
solution to overcome the interconnect scaling problem in giga-scale integrated circuits (ICs) …