In order to reduce design-cycle time and physical prototyping, equipment manufacturers
need to ascertain the thermal performance of new systems at the earliest possible stage of …

An overview of electro-thermal modeling of microsystems is presented. We consider the
most important coupling between thermal and electrical phenomena, and then focus on the …

This paper will deal with the modeling-problem of combining thermal subsystems (eg a
semiconductor module or package with a cooling radiator) making use of reduced models …

Compact thermal models have been constructed for different levels in electronic systems
with a variable degree of success. In this work first steps toward constructing a unifying …

An original, fully analytical, spectral domain decomposition approach is presented for the
time-dependent thermal modeling of complex nonlinear (3-D) electronic systems, from …

Thermal measurement and modeling of multi-die packages with vertical (stacked) and
lateral arrangement became a hot topic recently in different fields like RAM chip packaging …

The dynamic thermal behavior of electronic subsystems is characterized by their dynamic
compact models. These models have to be similar to the steady state models in describing …

The ability of monitoring the chip temperatures of power semiconductor modules at all times
under various realistic working conditions is the basis for investigating the limits of the …

The paper discusses two benchmark cases to facilitate the study of compact thermal models
for the purpose of component thermal characterization. The benchmarks represent idealised …

Light-emitting diode (LED) digital twins enable the implementation of fast digital design flows
for LED-based products as the lighting industry moves towards Industry 4.0. The LED digital …