A review: On the development of low melting temperature Pb-free solders
Pb-based solders have been the cornerstone technology of electronic interconnections for
many decades. However, with legislation in the European Union and elsewhere having …
many decades. However, with legislation in the European Union and elsewhere having …
Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy
KN Prabhu - Advances in Colloid and Interface Science, 2011 - Elsevier
Lead free solders are increasingly being used in electronic applications. Eutectic Sn–Cu
solder alloy is one of the most favored lead free alloys used for soldering in electronic …
solder alloy is one of the most favored lead free alloys used for soldering in electronic …
Interfacial reaction issues for lead-free electronic solders
The interfacial reactions between Sn-based solders and two common substrate materials,
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …
Microstructure evolution and shear fracture behavior of aged Sn3Ag0. 5Cu/Cu solder joints
X Hu, T Xu, LM Keer, Y Li, X Jiang - Materials Science and Engineering: A, 2016 - Elsevier
The effect of isothermal aging on the microstructure and shear strength of Sn3Ag0. 5Cu/Cu
(SAC305/Cu) solder joints were studied systematically. The single-lap shear samples of …
(SAC305/Cu) solder joints were studied systematically. The single-lap shear samples of …
Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5 Cu solder joints under extreme temperature thermal shock
R Tian, C Hang, Y Tian, L Zhao - Materials Science and Engineering: A, 2018 - Elsevier
The microstructure evolution and growth mechanism of interfacial intermetallic compounds
(IMCs) as well as the mechanism for early formation of cracks in Sn-3Ag-0.5 Cu solder joints …
(IMCs) as well as the mechanism for early formation of cracks in Sn-3Ag-0.5 Cu solder joints …
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
PF Yang, YS Lai, SR Jian, J Chen, RS Chen - Materials Science and …, 2008 - Elsevier
We report in this paper Young's moduli and hardness of Cu6Sn5, Cu3Sn, and Ni3Sn4
intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared …
intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared …
Interfacial intermetallic growth and shear strength of lead-free composite solder joints
In the present study, varying weight percentages of carbon nanotubes (CNTs) were
incorporated into Sn–Ag–Cu solder matrix, to form composite solders. Isothermal aging …
incorporated into Sn–Ag–Cu solder matrix, to form composite solders. Isothermal aging …
Sn–0.7 wt.% Cu/Ni interfacial reactions at 250 C
Sn–0.7 wt.% Cu alloy is a promising Pb-free solder, and Ni is a commonly used barrier layer
material. Sn–0.7 wt.% Cu/Ni couples are prepared and reacted at 250° C. The interfacial …
material. Sn–0.7 wt.% Cu/Ni couples are prepared and reacted at 250° C. The interfacial …
Thermal cycling reliability of aged PBGA assemblies-comparison of Weibull failure data and finite element model predictions
Isothermal aging causes detrimental changes in the microstructure, mechanical response,
and failure behavior of lead free solder joints in electronic assemblies. These material …
and failure behavior of lead free solder joints in electronic assemblies. These material …
Effect of adding 1 wt% Bi into the Sn–2.8 Ag–0.5 Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging
Intermetallic compound (IMC) formations of Sn–2.8 Ag–0.5 Cu solder with additional 1wt%
Bi were studied for Cu-substrate during soldering at 255° C and isothermal aging at 150° C …
Bi were studied for Cu-substrate during soldering at 255° C and isothermal aging at 150° C …