Dielectric breakdown of oxide films in electronic devices

A Padovani, P La Torraca, J Strand, L Larcher… - Nature Reviews …, 2024 - nature.com
Dielectric breakdown is a sudden and catastrophic increase in the conductivity of an
insulator caused by electrical stress. It is one of the major reliability issues in electronic …

[HTML][HTML] Comphy v3. 0—A compact-physics framework for modeling charge trapping related reliability phenomena in MOS devices

D Waldhoer, C Schleich, J Michl, A Grill, D Claes… - Microelectronics …, 2023 - Elsevier
Charge trapping plays an important role for the reliability of electronic devices and manifests
itself in various phenomena like bias temperature instability (BTI), random telegraph noise …

Towards a universal model of dielectric breakdown

A Padovani, P La Torraca, J Strand… - 2023 IEEE …, 2023 - ieeexplore.ieee.org
We present a microscopic breakdown (BD) model in which chemical bonds are weakened
by carrier injection and trapping into pre-existing structural defects (precursors) and by the …

Device‐to‐materials pathway for electron traps detection in amorphous GeSe‐based selectors

A Slassi, LS Medondjio, A Padovani… - Advanced Electronic …, 2023 - Wiley Online Library
The choice of the ideal material employed in selector devices is a tough task both from the
theoretical and experimental side, especially due to the lack of a synergistic approach …

Single-versus multi-step trap assisted tunneling currents—Part I: Theory

C Schleich, D Waldhör, T Knobloch… - … on Electron Devices, 2022 - ieeexplore.ieee.org
Leakage currents through dielectrics in modern logic, memory, and power devices, and back-
end interlevel layers can severely increase the time-zero power dissipation and shorten the …

Single-versus multi-step trap assisted tunneling currents—Part II: The role of polarons

C Schleich, D Waldhör, AM El-Sayed… - … on Electron Devices, 2022 - ieeexplore.ieee.org
Using the framework developed in the first part of this work, we demonstrate the capabilities
of the extended two-state nonradiative multi-phonon (NMP) model by reproducing leakage …

Filamentary Resistive Switching and Capacitance-Voltage Characteristics of the a-IGZO/TiO2 Memory

KJ Heo, HS Kim, JY Lee, SJ Kim - Scientific Reports, 2020 - nature.com
In this study, molybdenum tungsten/amorphous InGaZnO (a-IGZO)/TiO2/n-type Si-based
resistive random access memory (ReRAM) is manufactured. After deposition of the a-IGZO …

Molecular bridges link monolayers of hexagonal boron nitride during dielectric breakdown

A Ranjan, SJ O'Shea, A Padovani, T Su… - ACS Applied …, 2023 - ACS Publications
We use conduction atomic force microscopy (CAFM) to examine the soft breakdown of
monocrystalline hexagonal boron nitride (h-BN) and relate the observations to the defect …

Variability sources and reliability of 3D—FeFETs

M Pešić, B Beltrando, A Padovani… - 2021 IEEE …, 2021 - ieeexplore.ieee.org
Discovery of ferroelectricity (FE) in binary oxides enables the advent of FE memories and a
plethora of novel CMOS compatible building blocks spanning from the logic domain to high …

[HTML][HTML] A simple figure of merit to identify the first layer to degrade and fail in dual layer SiOx/HfO2 gate dielectric stacks

A Padovani, P La Torraca - Microelectronic Engineering, 2023 - Elsevier
Understanding the degradation dynamics and the breakdown sequence of a bilayer high-k
(HK) gate dielectric stack is crucial for the improvement of device reliability. We present a …