A highly linear broadband CMOS LNA employing noise and distortion cancellation

WH Chen, G Liu, B Zdravko… - IEEE Journal of Solid …, 2008 - ieeexplore.ieee.org
A broadband inductorless low-noise amplifier (LNA) design that utilizes simultaneous noise
and distortion cancellation is presented. Concurrent cancellation of the intrinsic third-order …

[图书][B] Low-frequency noise in advanced MOS devices

M Haartman, M Östling - 2007 - books.google.com
Low-Frequency Noise in Advanced CMOS Devices begins with an introduction to noise,
describing the fundamental noise sources and basic circuit analysis. The characterization of …

A wideband inductorless LNA with local feedback and noise cancelling for low-power low-voltage applications

H Wang, L Zhang, Z Yu - … Transactions on Circuits and Systems I …, 2010 - ieeexplore.ieee.org
A wideband noise-cancelling low-noise amplifier (LNA) without the use of inductors is
designed for low-voltage and low-power applications. Based on the common-gate-common …

Design of half adder using integrated leakage power reduction techniques

HB Katikala, TP Kumar, BM Reddy, BVVP Kumar… - Materials Today …, 2022 - Elsevier
The necessity for the development of compact, portable, and reliable electronic devices of
enhanced speed and efficiency has prompted the scaling of CMOS devices to be …

A common-gate amplifier with transconductance nonlinearity cancellation and its high-frequency analysis using the Volterra series

TW Kim - IEEE Transactions on Microwave Theory and …, 2009 - ieeexplore.ieee.org
A common-gate (CG) amplifier employing a transconductance nonlinearity cancellation
technique is designed for transmitter circuitry. The major contributor to the third-order …

[PDF][PDF] Scaled CMOS technology reliability users guide

M White - 2010 - Citeseer
The desire to assess the reliability of emerging scaled microelectronics technologies
through faster reliability trials and more accurate acceleration models is the precursor for …

Low-temperature plasma atomic layer etching of molybdenum via sequential oxidation and chlorination

Y Lee, Y Kim, J Son, H Chae - … of Vacuum Science & Technology A, 2022 - pubs.aip.org
In this study, an atomic layer etching (ALE) process for molybdenum was developed in two
steps: plasma oxidation and plasma chlorination. In the plasma oxidation step, molybdenum …

Gain-enhanced distributed amplifier using negative capacitance

A Ghadiri, K Moez - IEEE Transactions on Circuits and Systems …, 2010 - ieeexplore.ieee.org
This paper presents a new high-gain structure for the distributed amplifier. Negative
capacitance cells are exploited to ameliorate the loading effects of parasitic capacitors of …

A high IIP2 SAW-less superheterodyne receiver with multistage harmonic rejection

I Madadi, M Tohidian, K Cornelissens… - IEEE Journal of Solid …, 2016 - ieeexplore.ieee.org
In this paper, we propose and demonstrate the first fully integrated surface acoustic wave
(SAW)-less superheterodyne receiver (RX) for 4G cellular applications. The RX operates in …

Thermal atomic layer etching of cobalt using plasma chlorination and chelation with hexafluoroacetylacetone

Y Kim, S Chae, H Ha, H Lee, S Lee, H Chae - Applied Surface Science, 2023 - Elsevier
In this study, a thermal atomic layer etching process for Co comprising two steps––plasma
chlorination and chelation with hexafluoroacetylacetone (Hhfac)––was developed. The Co …