The out-of-control action plan (OCAP) is crucial in the wafer probing process of
semiconductor manufacturing as it systematically addresses and corrects deviations …

Wafer probing technique is important for testing integrated circuit devices. For the safety of
measured chips, the probe card must be examined to verify the performance before online …

In this work, finite element models are applied to analyze the influence of different
parameters on crack failure probability during wafer testing. Regarding simulations, there …

It is necessary to analyze the mechanism of bump wafer probing, for bump height variation
and probe mark area significantly influence flip chip assembly reliability. This causes the …

The number of input and output pads on high-performance IC devices has increased in
recent years, and hence wafer-level testing is conventionally performed using a probe card …

The probe card are test modules which are to classify the good semiconductor chips and
thin film before the packaging process. In the rapid growth a technology of semiconductor …

In wafer probe card fabrication, contact force and forward displacement of needle tip are
both important considerations affecting the probing results critically. This study establishes a …

Fabrication defects in IC chips are generally identified using a multi-layer needle probe card.
To prolong the life of the card, the needles in each layer should experience a similar contact …

In the semiconductor industry, fabrication defects in integrated circuit chips are generally
identified using a needle probe card. Ideally, the probe needles should have a high elastic …

The probing test is a typical quality control method for individual chips on a wafer. With a
proper design, the service life of probing needles in the probe card can be sufficiently …