A wideband on-interposer passive equalizer design for chip-to-chip 30-Gb/s serial data transmission

H Kim, J Cho, J Kim, S Choi, K Kim… - IEEE Transactions …, 2014 - ieeexplore.ieee.org
In this paper, a novel on-interposer passive equalizer is proposed for chip-to-chip high-
speed data transmission on the silicon-based on-interposer channel. The proposed …

Active silicon interposer design for interposer-level wireless power transfer technology for high-density 2.5-D and 3-D ICs

J Song, S Park, S Kim, JJ Kim… - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
In this paper, we first propose and demonstrate an interposer-level wireless power transfer
(WPT) scheme to reduce the number of wired power supply interconnections for high …

Novel differential-mode equalizer with broadband common-mode filtering for Gb/s differential-signal transmission

YJ Cheng, HH Chuang, CK Cheng… - IEEE Transactions on …, 2013 - ieeexplore.ieee.org
In high-speed differential signal transmission, signal integrity at the receiving end is mainly
determined by high quality of the differential-mode signal and good suppression of the …

Study on crosstalk between space transient interference microstrip lines using finite difference time domain method

YX Sun, Q Li, WH Yu, QH Jiang… - The Applied …, 2015 - journals.riverpublishers.com
In the paper, a Carson reciprocity theorembased numerical method is proposed to analyze
the crosstalk of space transient interference microstrip lines. Firstly, the proposed method is …

Passive equalizer design on high density interconnects for 25Gbps high speed IO and beyond

B Wu, T Mo - 2014 15th International Conference on Electronic …, 2014 - ieeexplore.ieee.org
We propose a passive equalizer design on high density interconnects to improve the serial
chip-to-chip communication channel performance. This new technique is a novel …

[PDF][PDF] 衬底材料对微带线间串扰耦合的影响研究

白雪, 徐雷钧 - 电子与信息学报, 2010 - edit.jeit.ac.cn
随着系统频率的提高, 衬底材料特性已成为影响信号走线之间串扰的一个不可忽略的因素.
该文基于传输线方程和频域S 参数对两平行微带线间串扰耦合进行理论分析, 并结合全波3 …

A stub equalizer for bidirectional and single-ended channels in NAND memory storage device systems

T Song, J Lee, C Hwang - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
In memory devices, such as solid-state drive, multitopology is used for interfaces where
multiple memory packages are connected to a controller using a branched transmission line …

基于HyperLynx 的电信号串扰仿真分析.

王强, 王杨, 赵目龙, 娄立新, 王祎帆 - Automotive Digest, 2024 - search.ebscohost.com
在高速数字电路中, 电信号串扰是影响信号完整性的一个主要因素. 针对近端电信号串扰噪声和
远端电信号串扰噪声进行理论建模, 借助信号完整性仿真工具HyperLynx 进行仿真分析 …

Bandlimited distortionless material design by an approximation of the heaviside condition

A Hartman, G Antonini, J Ekman… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
The distortionless propagation of signals in a medium offers a way to preserve the signal
integrity. There exists a condition for distortionless propagation on a transmission line known …

Enhanced passive equalizer using the open stub compensation technique

SH Huang, CW Kuo, CC Wang… - 2014 International …, 2014 - ieeexplore.ieee.org
In this paper, we propose an open-stub compensation technique for passive equalizers
used in high-speed digital communication systems. By simply lumping an open-stub to the …