Structural polymers are susceptible to damage in the form of cracks, which form deep within
the structure where detection is difficult and repair is almost impossible. Cracking leads to …

An Integrated Approach to Product Development Reliability Engineering presents an
integrated approach to the design, engineering, and management of reliability activities …

This study aims at investigating package materials based on polymer matrix for
microelectronics. The next generation package materials are expected to possess high heat …

Technology/Engineering/Mechanical A bestselling MEMS text... now better than ever. An
engineering design approach to Microelectromechanical Systems, MEMS and Microsystems …

Suitable as a reference work for reliability professionals or as a text for advanced
undergraduate or graduate students, this book introduces the reader to the widely dispersed …

The origin of homochirality in living systems is often attributed to the generation of
enantiomeric differences in a pool of chiral prebiotic molecules,, but none of the possible …

The development of electronics that can operate at high temperatures has been identified as
a critical technology for the next century. Increasingly, engineers will be called upon to …

Supply chains for electronic products are primarily driven by consumer electronics. Every
year new mobile phones, computers and gaming consoles are introduced, driving the …

Epoxy molding compounds (EMCs) are widely used as encapsulation materials for
protecting the semiconductor chips of plastic encapsulated microcircuits (PEMs) against …

Moisture induced swelling and sorption characteristics of four types of epoxy molding
compounds used in the packaging of semiconductor devices were experimentally …