A review of mechanical properties of lead-free solders for electronic packaging
H Ma, JC Suhling - Journal of materials science, 2009 - Springer
The characterization of lead-free solders, especially after isothermal aging, is very important
in order to accurately predict the reliability of solder joints. However, due to lack of …
in order to accurately predict the reliability of solder joints. However, due to lack of …
The bridge between the materials and devices of thermoelectric power generators
While considerable efforts have been made to develop and improve thermoelectric
materials, research on thermoelectric modules is at a relatively early stage because of the …
materials, research on thermoelectric modules is at a relatively early stage because of the …
Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling
L Zhang, D Xiong, Z Su, J Li, L Yin, Z Yao… - Materials Today …, 2022 - Elsevier
Abstract Sn-Ag-Cu system lead-free solders are considered to be promising solder series.
The growth of Sn whiskers on the solder surface is an important factor that threatens the …
The growth of Sn whiskers on the solder surface is an important factor that threatens the …
A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics
Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …
Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength
Thermal cycling aging studies on a lead-free 95.5 Sn–3.8 Ag–0.7 Cu solder joint were
investigated. Soldered lap joint specimens were fabricated by a solder reflow process using …
investigated. Soldered lap joint specimens were fabricated by a solder reflow process using …
Reliability of the aging lead free solder joint
Solder materials demonstrate evolving microstructure and mechanical behavior that
changes significantly with environmental exposures such as isothermal aging and thermal …
changes significantly with environmental exposures such as isothermal aging and thermal …
The influence of elevated temperature aging on reliability of lead free solder joints
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
Influencing factors on micromechanical properties of calcium (alumino) silicate hydrate C-(A-) SH under nanoindentation experiment
In Portland cement-based concrete, calcium (alumino) silicate hydrate (C-(A-) SH) is the
principal binding phase that governs its physical, mechanical, and durability properties. In …
principal binding phase that governs its physical, mechanical, and durability properties. In …
The effects of aging temperature on SAC solder joint material behavior and reliability
The effects of aging on mechanical behavior of lead free solders have been examined by
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …
Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
HLJ Pang, KH Tan, XQ Shi, ZP Wang - Materials Science and Engineering …, 2001 - Elsevier
Microstructure development of eutectic solder alloy (63Sn/37Pb) after thermal cycling aging
and its impact on the shear and fatigue failure of the solder joint has been investigated. The …
and its impact on the shear and fatigue failure of the solder joint has been investigated. The …