Overview of real-time lifetime prediction and extension for SiC power converters
Remaining useful lifetime prediction and extension of Si power devices have been studied
extensively. Silicon carbide (SiC) power devices have been developed and commercialized …
extensively. Silicon carbide (SiC) power devices have been developed and commercialized …
A comprehensive review toward the state-of-the-art in failure and lifetime predictions of power electronic devices
This paper discusses various types of failure mechanisms, precursor parameters, and
accelerated aging-based procedures to estimate the remaining life of power electronic …
accelerated aging-based procedures to estimate the remaining life of power electronic …
Study and handling methods of power IGBT module failures in power electronic converter systems
Power electronics plays an important role in a wide range of applications in order to achieve
high efficiency and performance. Increasing efforts are being made to improve the reliability …
high efficiency and performance. Increasing efforts are being made to improve the reliability …
A lifetime estimation technique for voltage source inverters
H Huang, PA Mawby - IEEE Transactions on Power Electronics, 2012 - ieeexplore.ieee.org
This paper presents a method to estimate the inverter lifetime so that we can predict a failure
prior to it actually happening. The key contribution of this study is to link the physics of the …
prior to it actually happening. The key contribution of this study is to link the physics of the …
Reliability of wide band gap power electronic semiconductor and packaging: A review
Y Wang, Y Ding, Y Yin - Energies, 2022 - mdpi.com
Wide band gap (WBG) power electronic devices, such as silicon carbide metal–oxide–
semiconductor field-effect transistors (SiC MOSFETs) and gallium–nitride high-electron …
semiconductor field-effect transistors (SiC MOSFETs) and gallium–nitride high-electron …
Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology
KN Tu, Y Liu - Materials Science and Engineering: R: Reports, 2019 - Elsevier
We review five solder joint reactions in 3D IC packaging technology which are of wide
interest:(1) Scallop-type growth of Cu 6 Sn 5 in solid-liquid interdiffusion reaction,(2) Whisker …
interest:(1) Scallop-type growth of Cu 6 Sn 5 in solid-liquid interdiffusion reaction,(2) Whisker …
Failure and reliability analysis of a SiC power module based on stress comparison to a Si device
The superior electro-thermal properties of silicon carbide (SiC) power devices permit higher
temperature of operation and enable higher power density compared with silicon devices …
temperature of operation and enable higher power density compared with silicon devices …
Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints
A Syed - 2004 Proceedings. 54th electronic components and …, 2004 - ieeexplore.ieee.org
Pb free solder is fast becoming a reality in electronic manufacturing due to marketing and
legislative pressures. The industry has pretty much concluded that various versions of …
legislative pressures. The industry has pretty much concluded that various versions of …
New physical model for lifetime estimation of power modules
IF Kovačević, U Drofenik… - The 2010 International …, 2010 - ieeexplore.ieee.org
In this paper a physical model for lifetime estimation of standard power modules is
proposed. The lifetime prediction is based on the assumption that the solder …
proposed. The lifetime prediction is based on the assumption that the solder …
Unveiling the damage evolution of SAC305 during fatigue by entropy generation
Low-cycle thermal-mechanical fatigue loadings induce progressive and permanent
degradation of mechanical properties of lead-free solder materials, and thus reduce the …
degradation of mechanical properties of lead-free solder materials, and thus reduce the …