S Pandey, TG Venkatesh - The Journal of Supercomputing, 2022 - Springer
Recent advances in 3D fabrication have allowed the development of 3D memory over the logic die. The 3D memory presents itself as a viable solution to the memory wall problem …
3D memories are becoming viable solutions for the memory wall problem and meeting the bandwidth requirements of memory intensive applications. The high bandwidth provided by …
A heterogeneous device technology reconfigurable logic fabric is proposed which leverages the cooperating advantages of distinct magnetic random access memory (MRAM)-based …
Streaming architectures are widely employed in hardware design particularly when high throughput is desired. A streaming architecture takes input and produces output at a fixed …