Co-packaged photonics for high performance computing: status, challenges and opportunities

R Mahajan, X Li, J Fryman, Z Zhang… - Journal of Lightwave …, 2021 - ieeexplore.ieee.org
Photonics die or integrated photonics modules co-packaged with compute engines have the
potential to deliver significant improvements in power, bandwidth and reach needed to meet …

Trending IC design directions in 2022

CH Chan, L Cheng, W Deng, P Feng… - Journal of …, 2022 - iopscience.iop.org
For the non-stop demands for a better and smarter society, the number of electronic devices
keeps increasing exponentially; and the computation power, communication data rate, smart …

A 3-D-integrated silicon photonic microring-based 112-Gb/s PAM-4 transmitter with nonlinear equalization and thermal control

H Li, G Balamurugan, T Kim, MN Sakib… - IEEE Journal of Solid …, 2020 - ieeexplore.ieee.org
Microring modulators (MRMs) with CMOS electronics enable compact low power transmitter
solutions for 400G Ethernet and co-packaged optical transceivers. In this article, we present …

Silicon photonic microring-based 4× 112 Gb/s WDM transmitter with photocurrent-based thermal control in 28-nm CMOS

J Sharma, Z Xuan, H Li, T Kim, R Kumar… - IEEE Journal of Solid …, 2021 - ieeexplore.ieee.org
This work presents a hybrid-integrated 4-micro-ring modulator-based wavelength-division
multiplexed (WDM) optical transmitter (OTX) in the O-band, suitable for co-packaged optics …

A 50-Gb/s PAM-4 silicon-photonic transmitter incorporating lumped-segment MZM, distributed CMOS driver, and integrated CDR

Q Liao, Y Zhang, S Ma, L Wang, L Li… - IEEE Journal of Solid …, 2021 - ieeexplore.ieee.org
This article presents a 50-Gb/s optical transmitter (TX), consisting of a 40-nm distributed
CMOS driver and a 180-nm silicon-photonic modulator. A lumped-segment Mach–Zehnder …

A 100-Gb/s PAM-4 optical receiver with 2-tap FFE and 2-tap direct-feedback DFE in 28-nm CMOS

H Li, CM Hsu, J Sharma, J Jaussi… - IEEE Journal of Solid …, 2021 - ieeexplore.ieee.org
Optical receivers (ORXs) with integrated CMOS electronics enable compact, low-power
solutions for 400-G Ethernet and co-packaged optics. In this article, we present a 100-Gb/s …

A 3D integrated energy-efficient transceiver realized by direct bond interconnect of co-designed 12 nm finfet and silicon photonic integrated circuits

PH Chang, A Samanta, P Yan, M Fu… - Journal of Lightwave …, 2023 - opg.optica.org
This article presents the first experimental demonstration of an energy-efficient electronic-
photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high …

A 100-Gb/s PAM4 optical transmitter in a 3-D-integrated SiPh-CMOS platform using segmented MOSCAP modulators

AH Talkhooncheh, W Zhang, M Wang… - IEEE Journal of Solid …, 2022 - ieeexplore.ieee.org
This article presents a 100-Gb/s four-level pulse-amplitude modulation (PAM4) optical
transmitter system implemented in a 3-D-integrated silicon photonics-CMOS platform. The …

A 56-Gb/s PAM-4 transmitter/receiver chipset with nonlinear FFE for VCSEL-based optical links in 40-nm CMOS

PJ Peng, PL Lee, HE Huang, WJ Huang… - IEEE Journal of Solid …, 2022 - ieeexplore.ieee.org
This article presents a 56-Gb/s four-level pulse amplitude modulation (PAM-4)
transmitter/receiver (TX/RX) chipset for optical link. The optical transmitter (TX) adopts a …

16-channel photonic–electric co-designed silicon transmitter with ultra-low power consumption

J Shi, M Jin, T Yang, H Shu, F Yang, H Liu… - Photonics …, 2023 - opg.optica.org
A hybrid integrated 16-channel silicon transmitter based on co-designed photonic integrated
circuits (PICs) and electrical chiplets is demonstrated. The driver in the 65 nm CMOS …