Low dielectric constant materials

W Volksen, RD Miller, G Dubois - Chemical reviews, 2010 - ACS Publications
Modern computer microprocessor chips are marvels of engineering complexity. For the
current 45 nm technology node, there may be nearly a billion transistors on a chip barely 1 …

Low dielectric constant materials for microelectronics

K Maex, MR Baklanov, D Shamiryan, F Lacopi… - Journal of Applied …, 2003 - pubs.aip.org
The ever increasing requirements for electrical performance of on-chip wiring has driven
three major technological advances in recent years. First, copper has replaced Aluminum as …

Low dielectric constant polymers for microelectronics

G Maier - Progress in polymer science, 2001 - Elsevier
A large variety of polymers has been proposed for use as materials with low dielectric
constants for applications in microelectronics. The chemical structures and selected …

Low dielectric constant materials for ULSI interconnects

M Morgen, ET Ryan, JH Zhao, C Hu… - Annual Review of …, 2000 - annualreviews.org
▪ Abstract As integrated circuit (IC) dimensions continue to decrease, RC delay, crosstalk
noise, and power dissipation of the interconnect structure become limiting factors for ultra …

Development of a low‐dielectric‐constant polymer for the fabrication of integrated circuit interconnect

SJ Martin, JP Godschalx, ME Mills… - Advanced …, 2000 - Wiley Online Library
For faster, smaller, and higher performance integrated circuits, a low dielectric constant
insulator is required to replace silicon dioxide. Here the properties of a new dielectric—SiLK …

Low–dielectric constant insulators for future integrated circuits and packages

PA Kohl - Annual review of chemical and biomolecular …, 2011 - annualreviews.org
Future integrated circuits and packages will require extraordinary dielectric materials for
interconnects to allow transistor advances to be translated into system-level advances …

Recent development of piezoelectric biosensors for physiological signal detection and machine learning assisted cardiovascular disease diagnosis

S Huang, Y Gao, Y Hu, F Shen, Z Jin, Y Cho - RSC advances, 2023 - pubs.rsc.org
As cardiovascular disease stands as a global primary cause of mortality, there has been an
urgent need for continuous and real-time heart monitoring to effectively identify irregular …

Impact of VUV photons on SiO2 and organosilicate low-k dielectrics: General behavior, practical applications, and atomic models

MR Baklanov, V Jousseaume, TV Rakhimova… - Applied Physics …, 2019 - pubs.aip.org
This paper presents an in-depth overview of the application and impact of UV/VUV light in
advanced interconnect technology. UV light application in BEOL historically was mainly …

Kinetics of copper drift in low-/spl kappa/polymer interlevel dielectrics

ALS Loke, JT Wetzel, PH Townsend… - … on Electron Devices, 1999 - ieeexplore.ieee.org
This paper addresses the drift of copper ions (Cu/sup+/) in various low-permittivity (low-/spl
kappa/) polymer dielectrics to identify copper barrier requirements for reliable interconnect …

Interconnect technology trend for microelectronics

R Liu, CS Pai, E Martinez - Solid-State Electronics, 1999 - Elsevier
In the past 30 years interconnect evolved from a single layer of Al deposited by evaporation
to multiple levels of sandwiched Ti/Al–Cu/TiN metal layers deposited by sophisticated …