Lead free soldering has become mainstream since the Restriction of Hazardous Substances
(RoHS) Directive. Solders have come a long way from the traditional SnPb (Tin-Lead) to …

In realistic applications, the solder joint is continually subjected to thermal-mechanical stress
due to the difference in the coefficient of thermal expansion (CTE) between the printed circuit …

Recent studies demonstrate significant reductions in mechanical properties of lead-free
interconnection materials in harsh environments such as automotive and military …

ABSTRACT A significant reliability problem with the baseline alloy SAC305 is the
deterioration of their mechanical properties and recrystallization of the microstructure after …

The reliability of an electronic product in harsh applications is typically limited by the fatigue
failure of one of the interconnected solder joints. Mechanical properties of common lead-free …

Solder joints in electronic assemblies are typically subjected to cyclic loadings, either in
actual applications or in accelerated life tests. Mismatches in the thermal expansion …

The reliability of an electronic assembly is often limited by the fatigue failure of one of the
interconnected solder joints due to the mismatch of Coefficient of Thermal Expansion (CTE) …

The reliability of an electronic product highly attributes to the fatigue failure of an
interconnected solder joint. The normal operating temperature for many electronic …

Fatigue failure of interconnected solder joints is a critical consideration for the reliability of an
electronic product. Commonly, fatigue properties of solder materials are investigated using …

SAC solder alloys have been widely used in electronic assembly, and its fatigue resistance
is a critical factor that affects the reliability of electronics. Bi is one of the candidate doped …