Effect of sn orientation on electromigration failure in CuSn solders
AM Pham, F Haq, S Sadasiva, G Li… - Journal of Electronic …, 2024 - Springer
Abstract Sn-Ag-Cu (SAC) has emerged as one of the most widely accepted lead-free solders
used as interconnecting material in electronic packaging. However, these systems still have …
used as interconnecting material in electronic packaging. However, these systems still have …
Control of Solder Microstructure Stimulated by Interface Condition of the UBM/Solder and Enhancement of Electromigration Reliability
H Mohanram, Y Kim, G Ni, CU Kim… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
This paper presents two example cases of controlling microstructures of lead-free solder
joints in a direction of improving electromigration (EM) reliability. Specifically, this paper …
joints in a direction of improving electromigration (EM) reliability. Specifically, this paper …
Study of Failure and Microstructural Evolution in SAC Solder Interconnects Induced by AC Electromigration Condition
YR Kim, AT Osmanson, CU Kim… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
The previously studied low-frequency pulsed direct current (DC) effects on electromigration
(EM) results suggest that non-DC effects on EM mechanisms in solder interconnects are …
(EM) results suggest that non-DC effects on EM mechanisms in solder interconnects are …
Study of SAC Solder Interconnect Parameters in Microelectronic Semiconductor Packaging and their Effects on Electromigration Failure Mechanisms
AT Osmanson - 2021 - mavmatrix.uta.edu
As the shrinkage of electronic devices becomes more appealing, so do their high capacity
and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend …
and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend …
[图书][B] The Effects of SnAgCu Solder Interconnect Package's Parameters on Electromigration Failure Mechanisms
YR Kim - 2021 - search.proquest.com
The primary concern of this dissertation is the electromigration (EM) failure mechanism
found in Sn-Ag-Cu (SAC) solder alloys integrated in WCSP (wafer-level chip scale package) …
found in Sn-Ag-Cu (SAC) solder alloys integrated in WCSP (wafer-level chip scale package) …