Progressive developments, challenges and future trends in laser shock peening of metallic materials and alloys: A comprehensive review
W Deng, C Wang, H Lu, X Meng, Z Wang, J Lv… - International Journal of …, 2023 - Elsevier
Grain refinement and arrangement is an effective strategy to enhance tensile and fatigue
properties of key metallic components. Laser shock peening (LSP) is one of surface severe …
properties of key metallic components. Laser shock peening (LSP) is one of surface severe …
Microstructure analysis and interfacial wave formation mechanism research of Mg/Al dissimilar metal laser impact welding in a vacuum environment
Y Zhou, Y Cao, M Cui, Z Yan, X Wang, H Liu - Journal of Manufacturing …, 2024 - Elsevier
Laser impact welding (LIW) joints for the center exists springback region, resulting in a small
effective welding area seriously affects the LIW joints performance problems. This paper for …
effective welding area seriously affects the LIW joints performance problems. This paper for …
The intelligent detection method for flip chips using CBN-S-Net algorithm with SAM images
Y Sha, Z He, H Gutierrez, J Du, W Yang, X Lu - Journal of Manufacturing …, 2022 - Elsevier
Flip chip has become one of the mainstream technologies in microelectronic packaging.
Solder bumps play an important role in the interconnection of flip chips packages. The …
Solder bumps play an important role in the interconnection of flip chips packages. The …