[HTML][HTML] Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys
Abstract Large Ag 3 Sn plates in solder joints can affect the reliability of electronics,
however, the factors affecting their nucleation and morphology are not well understood …
however, the factors affecting their nucleation and morphology are not well understood …
Pb-free solder joint thermo-mechanical modeling: state of the art and challenges
JPM Clech, RJ Coyle, B Arfaei - JOM, 2019 - Springer
Acceleration factors and predictive life models are of use to build-in board assembly
reliability and estimate solder joint life at the design stage. They allow designers to answer …
reliability and estimate solder joint life at the design stage. They allow designers to answer …
Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
The growth mechanisms of primary Cu 6 Sn 5 are studied in Sn-Cu alloys and solder joints
by combining EBSD, FIB-tomography and synchrotron radiography. With increasing cooling …
by combining EBSD, FIB-tomography and synchrotron radiography. With increasing cooling …
Heterogeneous microstructure and mechanical behaviour of Al-8.3 Fe-1.3 V-1.8 Si alloy produced by laser powder bed fusion
The relationship between processing parameters, microstructure, and mechanical properties
of Al-8.3 Fe-1.3 V-1.8 Si alloy processed by laser powder bed fusion is seldom studied …
of Al-8.3 Fe-1.3 V-1.8 Si alloy processed by laser powder bed fusion is seldom studied …
Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
The directional coefficient of thermal expansion (CTE) of intermetallics in electronic
interconnections is a key thermophysical property that is required for microstructure-level …
interconnections is a key thermophysical property that is required for microstructure-level …
Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections
ZL Ma, SA Belyakov, K Sweatman, T Nishimura… - Nature …, 2017 - nature.com
While many aspects of electronics manufacturing are controlled with great precision, the
nucleation of tin in solder joints is currently left to chance. This leads to a widely varying melt …
nucleation of tin in solder joints is currently left to chance. This leads to a widely varying melt …
Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0 Ag-0.5 Cu/Cu solder joints by using thermal gradient bonding
Z Zhang, X Hu, W Chen, S Tan, B Chen, J Wang… - Materials …, 2023 - Elsevier
In this study, the effects of the thermal gradient (TG) applied during the bonding process on
the microstructure, grain orientations and shear properties of Cu/SAC305/Cu solder joints …
the microstructure, grain orientations and shear properties of Cu/SAC305/Cu solder joints …
Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy
H Al-sorory, MS Gumaan, RM Shalaby - Soldering & Surface Mount …, 2023 - emerald.com
Purpose This study aims to investigate the effect of a small amount of TiO2 NPs addition on
the microstructure, thermal, mechanical and electrical properties of environmentally friendly …
the microstructure, thermal, mechanical and electrical properties of environmentally friendly …
Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5 Cu solder
The creep behaviour of directionally solidified SAC305 (96.5 Sn-3Ag-0.5 Cu wt%) alloy has
been investigated with integrated particle matrix composite (PMC) crystal plasticity …
been investigated with integrated particle matrix composite (PMC) crystal plasticity …
Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds
Abstract βSn nucleation is a key step in the formation of microstructure in electronic solder
joints. Here, the heterogeneous nucleation of βSn is studied in undercooled tin droplets …
joints. Here, the heterogeneous nucleation of βSn is studied in undercooled tin droplets …