In the microelectronics industry, the high thermal and electrical conductivity of copper (Cu),
the low volume density and the high efficiency of aluminum (Al) are extremely attractive. The …

In light of the fact that tungsten wire is gradually replacing high-carbon steel wire as a
diamond cutting line, it is particularly important to study tungsten alloy wire with better …

The Cu-GO layered composites with excellent thermal conductivity were fabricated by
ultrasonic-assisted electrodeposition and ultrasonic spraying composite processes …

For the tungsten‑copper composite salt solution prepared using the wet chemical method,
micron-sized W-10/15wt.% Cu precursors with hollow spherical shell shape were prepared …

The graphene oxide-Cu (GO-Cu) laminated composite films with nickel and silver
intermediate layers were prepared by electrodeposition, ultrasonic spraying and subsequent …

The addition of microalloying elements improves the microstructure and properties of copper-
based materials. In this study, WCu composites are synthesized in situ with Fe, Ni, or Mn as …

Abstract In this study, Cu@ Mo composite powders, prepared using an electroless plating
method, were applied to synthesize Mo70Cu30 composites using infiltration sintering and …

Steel-aluminum laminates show promise in industrial manufacturing, yet their utilization is
limited by unstable interface bonding. This study investigates the influence of laser texturing …

This article discusses the structural evolution, mechanical characteristics and tribological
behaviors of CuAl9Mn2+ W surface composites containing 0, 5, 10 and 15 vol.% W …

Recrystallization temperature (RCT) is a key factor influencing the working temperature
window of tungsten (W)-based plasma facing materials (PFMs). To investigate the effects of …