Self-packaged, flexible, bendable MEMS sensors and energy harvesters
HMA Hamid, Z Celik-Butler - IEEE Sensors Journal, 2021 - ieeexplore.ieee.org
Desire to integrate electronic devices more closely into the everyday life of the consumer led
to the emergence of flexible devices, which can conform to any shape surface. These …
to the emergence of flexible devices, which can conform to any shape surface. These …
Asymmetric low temperature cu-polymer hybrid bonding with Au passivation layer
MW Weng, SY Mao, D Liu, HW Hu… - … Symposium on VLSI …, 2021 - ieeexplore.ieee.org
In this study, an asymmetric Cu-polymer hybrid bonding technology was successfully
developed at 200° C, which uses SU-8 for polymer bonding and Au passivation for Cu …
developed at 200° C, which uses SU-8 for polymer bonding and Au passivation for Cu …
Direct bonding method for completely cured polyimide by surface activation and wetting
Polymer adhesives have emerged as a promising dielectric passivation layer in hybrid
bonding for 3D integration, but they raise misalignment problems during curing. In this work …
bonding for 3D integration, but they raise misalignment problems during curing. In this work …
[PDF][PDF] Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability
AS Salunke, J Alptekin, K Akula… - Journal of …, 2023 - imapsjmep.org
Copper (Cu) is the metal of choice for the redistribution layer (RDL) to facilitate fast I/O
communication in an integrated circuit (IC). Cu can electrochemically migrate (ECM) …
communication in an integrated circuit (IC). Cu can electrochemically migrate (ECM) …
Low temperature polyimide-to-polyimide direct bonding
HC Liu, C Chen - 2019 6th International Workshop on Low …, 2019 - ieeexplore.ieee.org
Low temperature polyimide-to-polyimide direct bonding Page 1 In this study, two polyimide (PI)
films were bonded at 250/300℃ for 60 min. A good bonding interface with few voids was …
films were bonded at 250/300℃ for 60 min. A good bonding interface with few voids was …