The evolution of electronic packaging technology towards the adoption of glass substrates
marks a significant advancement in overcoming the constraints posed by traditional organic …

3D integration consists of 3D integrated circuit (IC) packaging, 3D Si integration, and 3D IC
integration. They are different and in general the through-silicon via (TSV) separates 3D IC …

Interconnecting integrated circuits (ICs) and 3-D-ICs to the system board (printed circuit
board) are currently achieved using organic or silicon-based interposers. Organic …

3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They
are different and in general the TSV (through-silicon via) separates 3D IC packaging from …

A double-sided and ultrathin 3-D glass interposer with through package vias (TPVs) at same
pitch as through silicon vias (TSVs) in silicon interposers is developed to provide a …

Glass interposer panels and methods for forming the same are described herein. The
interposer panels include a glass substrate core formed from an ion-exchangeable glass. A …

This paper reports selective etching process of borosilicate glass by laser-induced deep
etching (LIDE) for through glass via (TGV) applications. Picosecond laser is used to modify …

This paper demonstrates thin glass interposers with fine pitch through package vias (TPV)
as a low cost and high I/O substrate for 3D integration. Interposers for packaging of ULK and …

This study explored Through Glass Via (TGV) Formation Technology by using Focused
Electrical Discharging Method for alkali-fee glass which has well matched CTE with Si. 2.5 …

Advanced packaging technology, also known as system scaling, bridges the gap between
chip and package sizes by mounting multiple chips on a single package substrate. 2.5-D …