Recent progress in physics-based modeling of electromigration in integrated circuit interconnects

WS Zhao, R Zhang, DW Wang - Micromachines, 2022 - mdpi.com
The advance of semiconductor technology not only enables integrated circuits with higher
density and better performance but also increases their vulnerability to various aging …

Machine learning in advanced IC design: A methodological survey

T Chen, GL Zhang, B Yu, B Li… - IEEE Design & …, 2022 - ieeexplore.ieee.org
The increasing complexity and size of design space poses significant challenges for
integrated circuit (IC) design. This article discusses the potential of machine learning (ML) …

Calibration and efficient evaluation of electromigration lifetime for interconnect wire sizing of multi-port networks

L Milor, S Ghosh - Microelectronics Reliability, 2023 - Elsevier
A canonical form of the hydrostatic stress equations for electromigration is proposed to
determine the minimum number of parameters to calibrate the model. An efficient …

TRouter: thermal-driven PCB routing via nonlocal crisscross attention networks

T Chen, S Xiong, H He, B Yu - IEEE Transactions on Computer …, 2023 - ieeexplore.ieee.org
In this article, we propose TRouter, a thermal-driven printed circuit board (PCB) routing
framework via a machine-learning model. The model is designed to capture the long-range …

Worst-case power integrity prediction using convolutional neural network

X Dong, Y Chen, J Chen, Y Wang, J Li, T Ni… - ACM Transactions on …, 2023 - dl.acm.org
Power integrity analysis is an essential step in power distribution network (PDN) sign-off to
ensure the performance and reliability of chips. However, with the growing PDN size and …

Wages: The Worst Transistor Aging Analysis for Large-scale Analog Integrated Circuits via Domain Generalization

T Chen, H Geng, Q Sun, S Wan, Y Sun, H Yu… - ACM Transactions on …, 2024 - dl.acm.org
Transistor aging leads to the deterioration of analog circuit performance over time. The worst
aging degradation is used to evaluate the circuit reliability. It is extremely expensive to …

Linear time electromigration analysis based on physics-informed sparse regression

L Chen, W Jin, M Kavousi… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
In this work, we propose a novel physics-informed sparse regression (PISR) framework to
solve stress evolution (described by Korhonen's equations) in general multisegment wires …

Unet-Astar: A Deep Learning-Based Fast Routing Algorithm for Unified PCB Routing

S Yin, M Jin, G Chen, G Gong, W Mao, H Lu - IEEE Access, 2023 - ieeexplore.ieee.org
In recent years, there has been extensive research on the routing problem of printed circuit
boards (PCBs). Due to the increasing number of pins, high pin density, and unique physical …

Reliability by design: avoiding migration-induced failure in IC interconnects

S Rothe, J Lienig - 2022 35th SBC/SBMicro/IEEE/ACM …, 2022 - ieeexplore.ieee.org
The reliability of integrated circuits is increasingly endangered by migration-induced
degradation of metal interconnects. The risk of failure due to migration is not only rising in …

PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks

S Lamichhane, W Jin, L Chen… - 2023 IEEE/ACM …, 2023 - ieeexplore.ieee.org
In this paper, we propose a novel machine learning-based approach, called PostPInn-Em,
for solving the partial differential equations for stress evolution in a confined metal …