Technical plasmas have a wide range of industrial applications. The Encyclopedia of
Plasma Technology covers all aspects of plasma technology from the fundamentals to a …

PMUT (Piezo Micromachined Ultrasound transducers) fabricated on silicon wafers require
the definition of the membrane for the membrane to flex. One way this is done is by etching …

The wafer level chip scale package (WLCSP) offers small form factor and high performance
solution. Lately, a novel solder material, SACQ (92.443 Sn4. 0Ag0. 5Cu8. 0Bi0. 05Ni 0.007 …

This paper demonstrates the ability of fully singulating a 775 μm thick Si wafer with a high
aspect ratio of 13: 1 and 20: 1, mask selectivity of> 200: 1 and achieving~ 90° vertical …

Wafer Level Chip Scale Package (WLCSP) is one of the most compact packages which
provide good electrical and thermal performance depending on the reliability of the solder …

The traditional method of dicing semiconductor wafers into individual die is accomplished
using diamond saws or more recently, using various laser based approaches. Both …

Abstract Through-Silicon-Via (TSV) wafer processes have been reviewed by several authors
previously, including temporary adhesive wafer bonding, high aspect ratio silicon etch, and …

As the dimensions of thin and tiny die trend smaller, they become candidates for laser
assisted plasma singulation (LAPS), otherwise referred to as plasma dicing. The process …

In order to meet the requirements of high performance flexible electronics in fast growing
portable consumer electronics, robotics and new fields such as Internet of Things (IoT), new …

In this thesis, the through-wafer via (TWV) technology is developed for signal and power
delivery on silicon interconnect fabric (Si-IF). The electrical performance of through-wafer via …