3D IC packaging utilizing a metal structure for heat reduction, noise shielding, and high...

Thermal–mechanical and signal reliability of a new differentiated TSV

Z Liu, H Jiang, Z Zhu, L Chen, Q Sun… - … on Electron Devices, 2022 - ieeexplore.ieee.org
The thermal–mechanical and signal reliability of through-silicon via (TSV) occupies an
important position in three-dimensional integrated circuits (3D-ICs). However, few studies …
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