Emerging trends in wide band gap semiconductors (SiC and GaN) technology for power devices

F Roccaforte, P Fiorenza, G Greco, RL Nigro… - Microelectronic …, 2018 - Elsevier
Among the wide band gap (WBG) semiconductors, silicon carbide (4H-SiC) and gallium
nitride (GaN) are nowadays recognized as outstanding materials for the future of power …

An overview of normally-off GaN-based high electron mobility transistors

F Roccaforte, G Greco, P Fiorenza, F Iucolano - Materials, 2019 - mdpi.com
Today, the introduction of wide band gap (WBG) semiconductors in power electronics has
become mandatory to improve the energy efficiency of devices and modules and to reduce …

State of the art on gate insulation and surface passivation for GaN-based power HEMTs

T Hashizume, K Nishiguchi, S Kaneki, J Kuzmik… - Materials science in …, 2018 - Elsevier
In this article, we review recent progress on AlGaN/GaN and InAlN/GaN metal-insulator-
semiconductor high-electron-mobility transistors (MIS-HEMTs) using Al-based oxides, nitride …

Cell equalisation circuits: A review

J Carter, Z Fan, J Cao - Journal of Power Sources, 2020 - Elsevier
Large Li-ion battery packs are an enabling technology for electric vehicles, smart homes and
the smart grid. Keeping the individual cells that make up the battery pack balanced reduces …

Development of GaN HEMTs fabricated on silicon, silicon-on-insulator, and engineered substrates and the heterogeneous integration

LH Hsu, YY Lai, PT Tu, C Langpoklakpam, YT Chang… - Micromachines, 2021 - mdpi.com
GaN HEMT has attracted a lot of attention in recent years owing to its wide applications from
the high-frequency power amplifier to the high voltage devices used in power electronic …

Characterization of SiO2/4H-SiC Interfaces in 4H-SiC MOSFETs: A Review

P Fiorenza, F Giannazzo, F Roccaforte - Energies, 2019 - mdpi.com
This paper gives an overview on some state-of-the-art characterization methods of SiO2/4H-
SiC interfaces in metal oxide semiconductor field effect transistors (MOSFETs). In particular …

Integrated 64 pixel UV image sensor and readout in a silicon carbide CMOS technology

J Romijn, S Vollebregt, LM Middelburg… - Microsystems & …, 2022 - nature.com
This work demonstrates the first on-chip UV optoelectronic integration in 4H-SiC CMOS,
which includes an image sensor with 64 active pixels and a total of 1263 transistors on a …

Selective doping in silicon carbide power devices

F Roccaforte, P Fiorenza, M Vivona, G Greco… - Materials, 2021 - mdpi.com
Silicon carbide (SiC) is the most mature wide band-gap semiconductor and is currently
employed for the fabrication of high-efficiency power electronic devices, such as diodes and …

Vertical GaN power diodes with a bilayer edge termination

JR Dickerson, AA Allerman, BN Bryant… - … on Electron Devices, 2015 - ieeexplore.ieee.org
Vertical GaN power diodes with a bilayer edge termination (ET) are demonstrated. The GaN
pn junction is formed on a low threading dislocation defect density (10 4-10 5 cm-2) GaN …

Vertical GaN p–n diode with deeply etched mesa and the capability of avalanche breakdown

H Fukushima, S Usami, M Ogura, Y Ando… - Applied Physics …, 2019 - iopscience.iop.org
A simple structure with high breakdown voltage and a low leakage current of a vertical GaN
p–n diode on a GaN free-standing substrate is demonstrated. We describe a vertical p–n …