Underfill flow in flip-chip encapsulation process: a review
The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …
encapsulation process. A total of 80 related works has been reviewed and being classified …
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints
RK Apalowo, MA Abas… - Soldering & Surface …, 2024 - emerald.com
Purpose This study aims to investigate the reliability issues of microvoid cracks in solder
joint packages exposed to thermal cycling fatigue. Design/methodology/approach The …
joint packages exposed to thermal cycling fatigue. Design/methodology/approach The …
Spatial analysis of underfill flow in flip-chip encapsulation
Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …
Filling efficiency of flip-chip underfill encapsulation process
Purpose This paper aims to introduce a new indicative parameter of filling efficiency to
quantify the performance and productivity of the flip-chip underfill encapsulation process …
quantify the performance and productivity of the flip-chip underfill encapsulation process …
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
This paper investigated the variation variables on the void formation in the no-flow underfill
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
Effect of different solder volumes on the laser soldering process: numerical and experimental investigation
Laser soldering is becoming more popular for soldering pin through-hole (PTH) components
onto printed circuit boards (PCBs). Solder volume influences soldering joint reliability …
onto printed circuit boards (PCBs). Solder volume influences soldering joint reliability …
A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process
Underfill encapsulation process regularly encounters productivity issue of long filling time
that incurs additional manufacturing costs. The package was optimized to attain least filling …
that incurs additional manufacturing costs. The package was optimized to attain least filling …
Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies
Purpose In line with the recent development of flip-chip reliability and underfill process, this
paper aims to comprehensively investigate the effect of different hourglass shape solder …
paper aims to comprehensively investigate the effect of different hourglass shape solder …
Microscale underfill dynamics and void formation of high-density flip-chip packaging: Experiments and simulations
E Wu, B Wang, S Zhang, Y Su, X Chen - Physics of Fluids, 2024 - pubs.aip.org
This research focuses on developing high-fidelity experimental and numerical models to
analyze microscale underfill dynamics and void formation in high-density flip-chip …
analyze microscale underfill dynamics and void formation in high-density flip-chip …
No-flow underfill: Effect of chip placement speed on the void formation using numerical method
No-flow underfill process can enhance the production lead time since the curing and reflow
of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow …
of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow …