This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …

In this study, the low Ag-content Sn–1.5 Ag–0.7 Cu (SAC157) lead-free solder was modified
for advance electronic components with minor additions of Bi. The microstructure, melt …

Abstract Bi-containing Sn0. 7Cu (SC) eutectic solder alloys were prepared and subjected to
directional solidification, through which new types of fiber reinforced eutectic composites …

In order to reduce the price of the SAC357 solder, the percentage of silver was reduced and
simultaneously the Bi-element was added to improve the properties of the solder. For this …

The aqueous solution cast method was used to create the biodegradable polymer
nanocomposite (PNC) films from a blend of poly (vinyl alcohol) PVA and poly (vinyl …

Abstract Hypoeutectic Sn–6.5 Zn alloy may be regarded as a better choice than eutectic Sn–
9Zn lead-free solder in microelectronics industry. In this study, the properties of hypoeutectic …

This paper investigates the effects of reaction time and temperature on the morphology and
growth mechanism of intermetallic compound (IMC) layers of plain Sn–8Zn–3Bi solder and …

The present study focuses on coarsening of Ag 3 Sn intermetallic compound in the Sn–1Ag–
0.5 Cu and Fe-modified Sn–1Ag–0.5 Cu solder alloy. The investigations showed that the Ag …

Cu–As alloy is viewed as one kind of secondary copper resources. It is difficult to
simultaneously recover copper and remove arsenic using conventional processes. To …

In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a
soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected …