A power module includes one or more semiconductor power devices having a power
overlay (POL) bonded thereto. A first heat sink is bonded to the semiconductor power …

BACKGROUND Heat management devices may be coupled to a heat generation device,
such as a power electronics device, to remove heat and lower the operating temperature of …

The present invention describes a Thermal Ground Plane (TGP) for cooling semiconductor
devices, integrated circuits, high-power electronics, radar Systems, laser radiation sources …

Foreign Application Priority Data Provided are a semiconductor device and a method of fabri
cating the same. The semiconductor device includes: an Jan. 9, 2014 (KR)........................ 10 …

(57) ABSTRACT A MMIC power amplifier circuit assembly comprised of a SiC substrate
having a plurality of microchannels formed therein, where a diamond layer is provided within …

A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar
surface. The cooling device also includes a channel layer bonded to an opposite side of the …

A cooling device comprises an upper surface configured to contact the baseplate, an inlet
manifold configured to receive a coolant, an outlet manifold configured to exhaust the …

Provided are a semiconductor device and a method of fabricating the same. The
semiconductor device includes: an active region provided on a substrate; an inlet channel …

(57) ABSTRACT A cooling device for a power module having an electronic module disposed
on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate …

A substrate for power electronics mounted thereon, comprises a middle ceramic layer
having a lower surface and an upper surface, an upper metal layer attached to the upper …