CORNERSTONE's silicon photonics rapid prototyping platforms: current status and future outlook

CG Littlejohns, DJ Rowe, H Du, K Li, W Zhang, W Cao… - Applied Sciences, 2020 - mdpi.com
Featured Application The CORNERSTONE silicon photonics rapid prototyping service can
be used by academic and industry researchers alike. The platform targets those who require …

Thermal analysis of InP lasers transfer printed to silicon photonics substrates

R Loi, J O'Callaghan, B Roycroft, Z Quan… - Journal of Lightwave …, 2018 - ieeexplore.ieee.org
The thermal performance of Fabry-Perot InP lasers integrated onto different silicon photonics
substrates by microtransfer printing is assessed. 500-μm-long ridge waveguide lasers on the …

Edge-coupling of O-band InP etched-facet lasers to polymer waveguides on SOI by micro-transfer-printing

R Loi, S Iadanza, B Roycroft… - IEEE Journal of …, 2019 - ieeexplore.ieee.org
O-band InP etched facets lasers were heterogeneously integrated by micro-transfer-printing
into a 1.54 μm deep recess created in the 3 μm thick oxide layer of a 220 nm SOI wafer. A 7× …

High-yield parallel transfer print integration of III-V substrate-illuminated C-band photodiodes on silicon photonic integrated circuits

G Muliuk, J Zhang, J Goyvaerts, S Kumari… - Silicon Photonics …, 2019 - spiedigitallibrary.org
Transfer printing is an enabling technology for the efficient integration of III-V semiconductor
devices on a silicon waveguide circuit. In this paper we discuss the transfer printing of …

Micro-transfer-printing of InP Photonic Devices to Silicon Photonics

R Loi, J O'Callaghan, B Roycroft… - 2019 Photonics & …, 2019 - ieeexplore.ieee.org
Micro-transfer-printing (μTP) has been applied to the heterogeneous integration of InP
devices to silicon photonics. The technology provides high-throughput parallel transfer of …

Interposing of Microelectronics by Micro Transfer Printing to Create 3-D Structures

K Oswalt, J Thostenson, T Moore… - 2020 IEEE 70th …, 2020 - ieeexplore.ieee.org
Micro transfer printing (μTP) is a useful method for heterogenous integration of micro-scale
devices but typically requires additional electrical interconnection of devices following print …