Underfill flow in flip-chip encapsulation process: a review
The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …
encapsulation process. A total of 80 related works has been reviewed and being classified …
Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process
The reliability issues of hygrothermally induced defects during thermal reflow of multilayer
ceramic capacitor was investigated to determine the root causes and propagation …
ceramic capacitor was investigated to determine the root causes and propagation …
Spatial analysis of underfill flow in flip-chip encapsulation
Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
This paper investigated the variation variables on the void formation in the no-flow underfill
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
Application of multi-quality parameter design in the optimization of underfilling process–a case study of a vehicle electronic module
Purpose This paper aims to discuss the key factors affecting the quality characteristics, such
as the number of solder balls, the spread distance of residual underfill and the completion …
as the number of solder balls, the spread distance of residual underfill and the completion …
Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies
Purpose In line with the recent development of flip-chip reliability and underfill process, this
paper aims to comprehensively investigate the effect of different hourglass shape solder …
paper aims to comprehensively investigate the effect of different hourglass shape solder …
Numerical simulation of laser soldering process on pin through hole (PTH)
The increasing demands in the miniaturization of microelectronic products promotes the
automation of electronic assembly and manufacturing process such as laser soldering to …
automation of electronic assembly and manufacturing process such as laser soldering to …
Microscale underfill dynamics and void formation of high-density flip-chip packaging: Experiments and simulations
E Wu, B Wang, S Zhang, Y Su, X Chen - Physics of Fluids, 2024 - pubs.aip.org
This research focuses on developing high-fidelity experimental and numerical models to
analyze microscale underfill dynamics and void formation in high-density flip-chip …
analyze microscale underfill dynamics and void formation in high-density flip-chip …
No-flow underfill: Effect of chip placement speed on the void formation using numerical method
No-flow underfill process can enhance the production lead time since the curing and reflow
of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow …
of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow …
Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly
RK Apalowo, MAF Muhamed Mukhtar… - Soldering & Surface …, 2024 - emerald.com
Purpose This study aims to investigate the design configuration for an optimum solder height
of reinforced SAC305 solder joint in an ultra-fine capacitor assembly. Design/methodology …
of reinforced SAC305 solder joint in an ultra-fine capacitor assembly. Design/methodology …