Microprocessor design has recently encountered many constraints such as power, energy,
reliability, and temperature. Among these challenging issues, temperature-related issues …

Interconnect scaling has become a major design challenge for traditional planar (2D)
integrated circuits (ICs). Three-dimensional (3D) IC that stacks multiple device layers …

Execution time is no longer the only metric by which computational systems are judged. In
fact, explicitly sacrificing raw performance in exchange for energy savings is becoming a …

3D multicore systems with stacked DRAM have the potential to boost system performance
significantly; however, this performance increase may cause 3D systems to exceed the …

The rising use of deep learning and other big-data algorithms has led to an increasing
demand for hardware platforms that are computationally powerful, yet energy-efficient. Due …

Modern processors such as Tilera's Tile64, Intel's Nehalem, and AMD's Opteron are
migrating memory controllers (MCs) on-chip, while maintaining a large, flat memory address …

Several key attributes of a 3D integrated chip structure are analyzed in this work. Critical
features related to the effect of the size of the substrate, heat sink, device layer, through …

In this article, we study the problem of how to maximize the throughput of a periodic real-time
system under a given peak temperature constraint. We assume that different tasks in our …

A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more
dies vertically with a dense, high-speed interface to increase the device density and reduce …

Data centers can go green by saving electricity in two major areas: computing and cooling.
Servers in data centers require a constant supply of cold air from on-site cooling …