An overview of non-destructive testing methods for integrated circuit packaging inspection
The article provides a review of the state-of-art non-destructive testing (NDT) methods used
for evaluation of integrated circuit (IC) packaging. The review identifies various types of the …
for evaluation of integrated circuit (IC) packaging. The review identifies various types of the …
Advances in thermal conductivity for energy applications: a review
Thermal conductivity is a crucial material property for a diverse range of energy
technologies, ranging from thermal management of high power electronics to thermal …
technologies, ranging from thermal management of high power electronics to thermal …
Monolithic integration of all‐in‐one supercapacitor for 3D electronics
A supercapacitor is usually stacked in the configuration of a layered sandwiched
architecture, and has been adopted as discrete energy storage device or circuit component …
architecture, and has been adopted as discrete energy storage device or circuit component …
Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper–copper bonding
H Park, H Seo, SE Kim - Scientific reports, 2020 - nature.com
An anti-oxidant Cu layer was achieved by remote mode N2 plasma. Remote mode plasma
treatment offers the advantages of having no defect formation, such as pinholes, by …
treatment offers the advantages of having no defect formation, such as pinholes, by …
A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading
Z Zhang, S Liu, K Ma, T Shi, Z Qian… - Fatigue & Fracture of …, 2022 - Wiley Online Library
Based on crystal plastic theory, a novel thermomechanical constitutive model was proposed
for Sn‐rich solder. Material parameters of the proposed constitutive model were determined …
for Sn‐rich solder. Material parameters of the proposed constitutive model were determined …
Multidimensional vision sensors for information processing
The visual scene in the physical world integrates multidimensional information (spatial,
temporal, polarization, spectrum and so on) and typically shows unstructured characteristics …
temporal, polarization, spectrum and so on) and typically shows unstructured characteristics …
Failure Mechanisms of Cu–Cu bumps under thermal cycling
The failure mechanisms of Cu–Cu bumps under thermal cycling test (TCT) were
investigated. The resistance change of Cu–Cu bumps in chip corners was less than 20 …
investigated. The resistance change of Cu–Cu bumps in chip corners was less than 20 …
Intelligent Design and Tuning Method for Embedded Thermoelectric Cooler (TEC) in 3D Integrated Microsystems
In this article, a genetic algorithm (GA)-based optimal design of thermoelectric cooler (TEC)
and a hybrid Bayesian optimization (BO)-artificial neural network (ANN)-based tuning …
and a hybrid Bayesian optimization (BO)-artificial neural network (ANN)-based tuning …
A W-band 3-D integrated mini-SAR system with high imaging resolution on UAV platform
ML Ding, CB Ding, L Tang, XM Wang, JM Qu… - IEEE Access, 2020 - ieeexplore.ieee.org
The light-small multi-rotor unmanned aerial vehicle (UAV) carrying with a mini synthetic
aperture radar (SAR) payload has provided an advanced information acquisition technology …
aperture radar (SAR) payload has provided an advanced information acquisition technology …
Intermediate low-melting-temperature solder thermal cycling enhancement using bismuth and indium microalloying
YW Lee, TK Lee, JP Jung - Journal of Electronic Materials, 2023 - Springer
Abstract In general, Sn-Ag-Cu solder is widely used for interconnections in semiconductor
device packaging. However, recently, several factors have been considered to implement …
device packaging. However, recently, several factors have been considered to implement …