Science and art of ductile grinding of brittle solids

H Huang, X Li, D Mu, BR Lawn - International Journal of Machine Tools …, 2021 - Elsevier
Prior to any practical application, brittle material components may need to be machined to a
high degree of precision in order to avoid functional breakdown as well as to maintain …

Diamond machining of silicon: a review of advances in molecular dynamics simulation

S Goel, X Luo, A Agrawal, RL Reuben - International Journal of Machine …, 2015 - Elsevier
Molecular dynamics (MD) simulation has enhanced our understanding about ductile-regime
machining of brittle materials such as silicon and germanium. In particular, MD simulation …

Atomic-scale surface of fused silica induced by chemical mechanical polishing with controlled size spherical ceria abrasives

G Xu, Z Zhang, F Meng, L Liu, D Liu, C Shi… - Journal of Manufacturing …, 2023 - Elsevier
Fused silica is widely used in precision optical devices for its excellent optical properties.
However, it has hard and brittle nature, becoming a difficult-to-process material. This makes …

Numerical simulation of materials-oriented ultra-precision diamond cutting: review and outlook

L Zhao, J Zhang, J Zhang, H Dai… - … Journal of Extreme …, 2023 - iopscience.iop.org
Ultra-precision diamond cutting is a promising machining technique for realizing ultra-
smooth surface of different kinds of materials. While fundamental understanding of the …

Influence of microstructure on the cutting behaviour of silicon

S Goel, A Kovalchenko, A Stukowski, G Cross - Acta Materialia, 2016 - Elsevier
We use molecular dynamics simulation to study the mechanisms of plasticity during cutting
of monocrystalline and polycrystalline silicon. Three scenarios are considered:(i) cutting a …

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

L Zhao, J Zhang, J Zhang, A Hartmaier - Ceramics International, 2021 - Elsevier
Deformation-induced characteristics of surface layer strongly rely on loading condition-
related operating deformation modes. In the current study we reveal the mechanisms …

The current understanding on the diamond machining of silicon carbide

S Goel - Journal of Physics D: Applied Physics, 2014 - iopscience.iop.org
Abstract The Glenn Research Centre of NASA, USA (www. grc. nasa. gov/WWW/SiC/, silicon
carbide electronics) is in pursuit of realizing bulk manufacturing of silicon carbide (SiC) …

Review of single-point diamond turning process in terms of ultra-precision optical surface roughness

S Hatefi, K Abou-El-Hossein - The International Journal of Advanced …, 2020 - Springer
Ultra-precision machining is the recent realm subsequent to conventional precision
machining processes. Recently, achieving nanoscale features on products has become …

Molecular dynamics simulation study of deformation mechanisms in 3C–SiC during nanometric cutting at elevated temperatures

SZ Chavoshi, X Luo - Materials Science and Engineering: A, 2016 - Elsevier
Molecular dynamics (MD) simulation was employed in this study to elucidate the dislocation/
amorphization-based plasticity mechanisms in single crystal 3C–SiC during nanometric …

Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation

B Meng, D Yuan, S Xu - International Journal of Mechanical Sciences, 2019 - Elsevier
To study the influence of strain rate and heat effect on the removal behavior of SiC, the
dislocation nucleation/propagation, amorphization and abrasive wear behavior are …