A semiconductor chip including a semiconductor substrate, an interconnect structure and a
memory cell array is provided. The semiconductor substrate includes a logic circuit. The …

US11158368B2 - Static random-access memory cell design - Google Patents US11158368B2
- Static random-access memory cell design - Google Patents Static random-access memory …

2021-12-10 Assigned to SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
reassignment SEMICONDUCTOR ENERGY LABORATORY CO., LTD. ASSIGNMENT OF …

Primary Examiner—Scott B Geyer (74) Attorney, Agent, or Firm—Akona IP PC (57)
ABSTRACT Disclosed herein are integrated circuit (IC) structures, pack ages, and devices …

Embodiments of the present disclosure are based on recog nition that using a glass support
structure at the back side of an IC structure with TFT memory may advantageously reduce …

2021-12-02 Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
LIMITED reassignment TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY …

A memory device includes metal interconnect structures embedded within dielectric material
layers that overlie a top surface of a substrate, a thin film transistor embedded in a first …

Some embodiments include apparatuses and methods of forming the apparatuses. One of
the apparatuses includes a memory cell, first, second, and third data lines, and first and …

A semiconductor structure and a method for manufacturing same. The semiconductor
structure includes a storage unit, which includes: a first dielectric layer and a metal bit line …

Assignees: Abhishek A. Sharma, Hillsboro, OR (US); Albert B. Chen, Portland, OR (US);
Wilfred Gomes, Portland, OR (US); Fatih Hamzaoglu, Portland, OR (US); Travis W. Lajoie …