Rate-dependent mechanical properties of cured conductive adhesives and drop impact behavior of adhesive bonding points in electronic interconnection

G Xiao, T Wang, X Shu, Y Ma, X Ji - Journal of Materials Science: Materials …, 2022 - Springer
Given the boom of portable electronic products and the increasing risk of drop impact load in
electronic interconnection points, the rate-dependent mechanical properties of cured …

Construction and Verification of Hyperelastic Constitutive for Polymer Materials

C Zhong, X Peng, C Li, YQ Wan, SM Xue… - 2022 23rd …, 2022 - ieeexplore.ieee.org
Finite element analysis (FEA) has become an important tool for evaluating drop reliability of
consumer electronic products. However, the accuracy of FEA highly depends on the …

Effect of design factors of a mobile phone on the reliability risks of on-board packages under product-level drop conditions

Z Liu, L Shi, Z Chen, W Zhu - 2020 21st International …, 2020 - ieeexplore.ieee.org
Smart mobile phones are susceptible to drop impact so the reliability of on-board packages
under drop condition is a major concern to be addressed. For the efficiency of rapid …

Numerical Study on the Correlation between Board-level Drop and Shock Tests for Chip-Scale Packages

HH Nguyen, C Lyu, K Meier… - 2024 25th International …, 2024 - ieeexplore.ieee.org
The JEDEC-standard board-level drop test (1500 g, 0.5 ms) has been used widely to assess
the performance of solder joints in IC packages. However, it still has many drawbacks …

Effect of dimension of board and micro-bumps on interconnection stress under drop test

M Lv, S Liu, T Chen, Y Liu, J Liu… - 2021 22nd International …, 2021 - ieeexplore.ieee.org
The reliability of electronic packaging is one of the most concerned issues, and the board-
level drop test has become a key qualification test for assessing the impact reliability of …