Embodiments herein describe a photonic chip which includes a coupling interface for
evanescently coupling the chip to a waveguide on an external substrate. In one …

Planar lightwave circuits with a polymer coupling waveguide optically coupling a planar
waveguide over a first region of a substrate to an optical component, such as a laser, affixed …

An optical subassembly includes a planar dielectric waveguide structure that is deposited at
temperatures below 400 C. The waveguide provides low film stress and low optical signal …

A method for co-packaging multiple light engines in a switch module is provided. The
method includes providing a module substrate with a minimum lateral dimension no greater …

H04B 10/00(2013.01) HOIS 5/00(2006.01) HOIS 5/022(2021.01) HOIS 5/02(2006.01) HOIS
5/323(2006.01) H04B 10/27(2013.01) H04B 10/07(2013.01) GOIR 31/26(2020.01) GO2B …

(57) ABSTRACT A co-packaged optical module includes a substrate, a processor arranged
on the substrate and a plurality of light engines mounted around the processor on the …

The semiconductor package includes an upper semiconduc torchip stacked on a package
substrate and a Support layer or a lower semiconductor chip disposed between the upper …

The present disclosure relates to an optical fiber structure, an optical communication
apparatus and a manufacturing process for manufacturing the same. The optical fiber …

Embodiments herein describe a photonic chip which includes a coupling interface for
evanescently coupling the chip to a waveguide on an external substrate. In one …

A photonics device includes a silicon wafer including an upper surface region, a trench
region, and a ridge structure. The ridge structure electrically isolates the upper surface …