The restriction of using toxic and harmful Sn-Pb solders has led to the rapid development of
lead-free solders in recent decades. This research on the effect of indium (In) microalloying …

Solder joints play a critical role in electronic devices by providing electrical, mechanical and
thermal interconnections. These miniature joints are also the weakest links in an electronic …

As temperature cycling drives fatigue failure of solder joints in electronic modules,
characterisation of the thermal fatigue response of different solder alloy formulations in BGA …

The surface finish (SF) becomes a part of the solder joint during assembly and improves the
component's reliability. Furthermore, the SF influences the solder joint's reliability by …

Aiming for a suitable die-attached substrate for Ag-sintered joint technology during harsh
operating environment, three surface finishes of sputtered Ti/Ag-layers, electroless Ni-/Pt-/Ag …

Since the restriction of hazardous substances (RoHS) directive, lead-free soldering has
been widely broad adopted. In many applications, lead-free alloys have been substituted for …

The shift to lead-free solder alternatives led to the development of Sn–Ag–Cu (SAC) alloys
as the most used solders due to their superior mechanical properties and reliability …

Due to the increase in working hours, the reliability of rubber O-ring seals used in hydraulic
systems of transfer machines will change. While traditional methods can only analyze one of …

The 42 wt.% Sn–58 wt.% Bi (Sn-58Bi) Ball Grid Array (BGA) solder balls were mounted to
electroless nickel-electroless palladium-immersion gold (ENEPIG) pads by employing the …

Recently, research into the factors that influence the formation and growth of intermetallic
compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important …