There is an increasing need for the development of superior, safe, and more sophisticated
implants, especially as our society historically has been moving towards an increasingly …

Field-emission devices are promising candidates to replace silicon fin field-effect transistors
as next-generation nanoelectronic components. For these devices to be adopted, nanoscale …

In this paper, the utilization of lithographic materials for semiconductor patterning
applications based on optical and EUV radiation sources is reviewed. Photoresist platforms …

Understanding the (dis) assembly mechanisms of large metallosupramolecules is critical in
their design, stability and application. The inherent complexity of these structures leads to …

Following electrospray ionization, it is common for analytes to enter the gas phase
accompanied by a charge-carrying ion, and in most cases, this addition is required to enable …

A new class of electron bean negative tone resist materials has been developed based on
heterometallic rings. The initial resist performance demonstrates a resolution of 15 nm half …

Both the cluster chemistry of tin and lanthanides have attracted extensive research interest,
showing wide applications in catalysis, magnetism, luminescence, and lithography …

Polymetallic complexes can be assembled using a wide array of polydentate ligands that
give an almost unlimited toolbox to prepare new molecular architectures with fascinating …

An approach is presented for nanoscale patterning of zinc oxide (ZnO) using electron beam
(e-beam) lithography for future nanoelectronic devices and for hard lithographic masks. Zinc …

In recent years, low-molecular-weight assemblies have emerged as remarkable building
blocks of supramolecular structures. To fully understand the molecular assembly mechanism …